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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/28 tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com serial eeprom series standard eeprom i 2 c bus eeprom (2-wire) BR24T1M-3AM general description br24t1m - 3am is a serial eeprom of i 2 c bus interface method features ? all controls available by 2 ports of serial clock(scl) and serial data(sda) ? other devices than eeprom can be connected to the same port, saving microcontroller port ? 1.7v to 5.5v single power source operation most suitable for battery use ? 1.7v to 5.5v wide limit of operating voltage, possible 1mhz operation ? page write mode useful for in itial value write at factory shipment ? self-timed programming cycle ? low current consumption ? prevention of write mistake ? wp (write protect) function added ? prevention of write mistake at low voltage ? more than 1 million write cycles ? more than 40 years data retention ? noise filter built in scl / sda terminal ? initial delivery state ffh ? aec-q100 grade3 qualified page write page size 256 bytes product number BR24T1M-3AM BR24T1M-3AM capacity bit format type power source voltage package 1mbit 128k8 br24t1mfj-3am 1.7v to 5.5v sop-j8 br24t1mf-3am sop8 packages w(typ) x d(typ)x h(max) figure 1. sop-j8 4.90mm x 6.00mm x 1.65mm sop8 5.00mm x 6.20mm x 1.71mm
. 2/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com absolute maximum ratings (ta=25c) parameter symbol rating unit remark supply voltage vcc -0.3 to +6.5 v storage temperature tstg -65 to +150 c operating temperature topr -40 to +85 c input voltage / output voltage \ -0.3 to vcc+1.0 v the max value of input voltage/out put voltage is not over 6.5v. when the pulse width is 50ns or less, the min value input voltage/output voltage is not lower than -1.0v. junction temperature tjmax 150 c junction temperature at the storage condition electrostatic discharge voltage (human body model) v esd -4000 to +4000 v caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. thermal resistance (note1) parameter symbol thermal resistance (typ) unit 1s (note3) 2s2p (note4) sop-j8 junction to ambient ja 149.3 76.9 c/w junction to top characterization parameter (note2) jt 18 11 c/w sop8 junction to ambient ja 197.4 109.8 c/w junction to top characterization parameter (note2) jt 21 19 c/w (note1)based on jesd51-2a(still-air) (note2)the thermal characterization parameter to report the diff erence between junction temperature and the temperature at the top center of the outside surface of the component package. (note3)using a pcb board based on jesd51-3. layer number of measurement board material board size single fr-4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note4)using a pcb board based on jesd51-7. layer number of measurement board material board size 4 layers fr-4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m memory cell characteristics (ta=25c, vcc=1.7v to 5.5v) parameter limit unit min typ max write cycles (note5) 1,000,000 - - times data retention ( note5 ) 40 - - years (note5) not 100% tested recommended operating ratings parameter symbol rating unit min max power source voltage vcc 1.7 5.5 v input voltage v in 0 vcc bypass capacitor c 0.1 - f
. 3/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com dc characteristics (unless otherwise specified, ta=-40c to +85c, vcc =1.7v to 5.5v) parameter symbol limit unit conditions min typ max input high voltage 1 v ih1 0.7vcc - vcc+1.0 v input low voltage 1 v il1 -0.3 (note1) - +0.3vcc v output low voltage 1 v ol1 - - 0.4 v i ol =3.0ma, 2.5v Q vcc Q 5.5v (sda) output low voltage 2 v ol2 - - 0.2 v i ol =0.7ma, 1.7v Q vcc 2.5v (sda) input leakage current i li -1 - +1 a v in =0 to vcc output leakage current i lo -1 - +1 a v out =0 to vcc (sda) supply current (write) i cc1 - - 4.5 ma v cc =5.5v, f scl =1mhz, t wr =5ms, byte write, page write supply current (read) i cc2 - - 2.0 ma v cc =5.5v, f scl =1mhz random read, current read, sequential read standby current i sb - - 3.0 a v cc =5.5v, sdascl=vcc a0, a1, a2=gnd, wp=gnd (note1) when the pulse width is 50ns or less, it is -1.0v. ac characteristics (unless otherwise specified, ta=-40 c to +85c, vcc=1.7v to 5.5v) parameter symbol limit unit min typ max clock frequency f scl - - 1000 khz data clock ?high? period t high 0.30 - - s data clock ?low? period t low 0.5 - - s sda, scl (input) rise time (note2) t r - - 0.12 s sda, scl (input) fall time (note2) t f1 - - 0.12 s sda (output) fall time (note2) t f2 - - 0.12 s start condition hold time t hd:sta 0.25 - - s start condition setup time t su:sta 0.20 - - s input data hold time t hd:dat 0 - - ns input data setup time t su:dat 50 - - ns output data delay time t pd 0.05 - 0.45 s output data hold time t dh 0.05 - - s stop condition setup time t su:sto 0.25 - - s bus free time t buf 0.5 - - s write cycle time t wr - - 5 ms noise spike width (sda, scl) t i - - 0.05 s wp hold time t hd:wp 1.0 - - s wp setup time t su:wp 0.1 - - s wp high period t high:wp 1.0 - - s (note2) not 100% tested ac characteristics condition parameter symbol conditions unit load capacitance c l 100 pf sda, scl (input) rise time t r 20 ns sda, scl (input) fall time t f1 20 ns input data level v il1 /v ih1 0.2v cc /0.8vcc v input/output data timing reference level - 0.3v cc /0.7vcc v
. 4/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com serial input / output timing figure 2-(e). wp timing at write cancel figure 2-(d). wp timing at write execution figure 2-(c). write cycle timing figure 2-(b). start-stop bit timing figure 2-(a). serial input / output timing (1) input read at the rise edge of scl (2) data output in sync with the fall of scl scl sda ( ) sda ( ) tr tf1 thigh tsu:dat tlow thd:dat tdh tpd tbuf thd:sta 70% 30% 70% 70% 30% 70% 70% 30% 30% 70% 70% 30% 70% 70% 70% 70% 30% 30% 30% 30% tf2 70% 70% tsu:sta thd:sta start condition tsu:sto stop condition 30% 30% 70% 70% d0 ack twr write data (n-th address) start condition stop condition 70% 70% data(1) d0 ack d1 data(n) ack twr 30% 70% stop condition thd:wp tsu:wp 30% 70% data(1) d0 d1 ack data(n) ack thigh:wp 70% 70% twr 70% (input) (output) scl sda scl sda scl sda wp scl sda wp
. 5/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com block diagram figure 3. block diagram pin configuration (top view) pin descriptions terminal number terminal name input/ output descriptions 1 a0 input don?t use (note1) 2 a1 input slave address setting (note2) 3 a2 input slave address setting (note2) 4 gnd - reference voltage of all input / output, 0v 5 sda input/ output serial data input serial data output 6 scl input serial clock input 7 wp input write protect terminal 8 vcc - connect the power source. (note1) pins not used as device address may be set to any of ?h ?, 'l', and 'hi-z'. (note2) a1 and a2 are not allowed to use as open 1 1 1 2 1 3 1 4 1 1 6 1 5 BR24T1M-3AM a0 1 7 a1 a2 gnd vcc wp scl 8 sda 8 7 6 5 4 3 2 1 sda scl wp vcc gnd a 2 a 1 a 0 a ddress decoder word a ddress register data register control circuit high voltage generating circuit power source voltage detection 8bit a ck start stop (note1) a0= don't use 1mbit eeprom array ( note1 ) 17bit
. 6/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves figure 4. input high voltage1 vs supply voltage (a0, a1, a2, scl, sda, wp) figure 5. input low voltage1 vs supply voltage (a0, a1, a2, scl, sda, wp) figure 6. output low voltage1 vs output low current (vcc=2.5v) figure 7. output low voltage2 vs output low current (vcc=1.7v) 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) input low voltage1 : v il1 (v) ta=-40 ta= 25 ta= 85 spec 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) input high voltage1 : v ih1 (v) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 0123456 output low current : i ol (ma) output low voltage1 : v ol2 (v) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 0123456 output low current: i ol (ma) output low voltage1: v ol1 (v) spec ta=-40 ta= 25 ta= 85
. 7/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 8. input leakage current vs supply voltage (a0, a1, a2, scl, wp) figure 9. output leakage current vs supply voltage (sda) 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage : vcc(v) input leakage current : i li (a) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage: vcc(v) output leakage current : i lo (a) ta=-40 ta= 25 ta= 85 spec figure 10. supply current (write) vs supply voltage (f scl =1mhz) 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) supply current (write) : icc1(ma) spec ta=-40 ta= 25 ta= 85 figure 11. supply current (read) vs supply voltage (f scl =1mhz) 0 0.5 1 1.5 2 2.5 0123456 supply voltage : vcc(v) supply current (read) : i cc2 (ma) spec ta=-40 ta= 25 ta= 85
. 8/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 13. clock frequency vs supply voltage 0.1 1 10 100 1000 10000 0123456 supply voltage : vcc(v) clock frequency : f scl (khz) spec ta=-40 ta= 25 ta= 85 figure 14. data clock high period vs supply voltage 0 0.1 0.2 0.3 0.4 0123456 supply voltage : vcc(v) data clock high period : t high (s) spec ta=-40 ta= 25 ta= 85 figure 15. data clock low period vs supply voltage 0 0.1 0.2 0.3 0.4 0.5 0.6 0123456 supply voltage : vcc(v) data clock low period : t low (s) spec ta=-40 ta= 25 ta= 85 figure 12. standby current vs supply voltage 0 0.5 1 1.5 2 2.5 3 3.5 0123456 supply voltage : vcc(v) standby current : i sb (a) spec ta=-40 ta= 25 ta= 85
. 9/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 18. start condition setup time vs supply voltage -0.05 0 0.05 0.1 0.15 0.2 0.25 0123456 supply voltage : vcc(v) start condition setup time : t su:sta (s) spec ta=-40 ta= 25 ta= 85 figure 19. input data hold time vs supply voltage (high) -150 -100 -50 0 50 0123456 supply voltage : vcc(v) input data hold time : t hd:dat (ns) spec ta=-40 ta= 25 ta= 85 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0123456 supply voltage: vcc(v) sda (output) fall time: t f2 (s) spec ta=-40 ta= 25 ta= 85 figure 17. start condition hold time vs supply voltage 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) start condition hold time : t hd:sta (s) spec ta=-40 ta= 25 ta= 85 figure 16. sda (output) fall time vs supply voltage
. 10/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued -150 -100 -50 0 50 0123456 supply voltage : vcc(v) input data hold time : t hd:dat (ns) spec ta=-40 ta= 25 ta= 85 figure 20. input data hold time vs supply voltage (low) 0 10 20 30 40 50 60 0123456 supply voltage : vcc(v) input data setup time : t su:dat (ns) spec ta=-40 ta= 25 ta= 85 figure 21 input data setup time vs supply voltage (high) 0 10 20 30 40 50 60 0123456 supply voltage : vcc(v) input data setup time : t su:dat (ns) spec ta=-40 ta= 25 ta= 85 figure 22. input data setup time vs supply voltage (low) 0 0.1 0.2 0.3 0.4 0.5 0123456 supply voltage : vcc(v) output data delay time : t pd0 (s) spec spec ta=-40 ta= 25 ta= 85 figure 23. output data delay time vs supply voltage (low)
. 11/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued 0 0.1 0.2 0.3 0.4 0.5 0.6 0123456 supply voltage : vcc(v) bus free time : t buf (s) spec ta=-40 ta= 25 ta= 85 figure 26. bus free time vs supply voltage 0 0.1 0.2 0.3 0.4 0.5 0123456 supply voltage : vcc(v) output data delay time : t pd1 (s) spec spec ta=-40 ta= 25 ta= 85 figure 24. output data delay time vs supply voltage (high) 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) stop condition setup time : t su:sto (s) spec ta=-40 ta= 25 ta= 85 figure 25. stop condition setup time vs supply voltage 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) write cycle time : t wr (ms) ta=-40 ta= 25 ta= 85 spec figure 27. write cycle time vs supply voltage
. 12/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(sda low) : t i (s) spec ta=-40 ta= 25 ta= 85 figure 31. noise spike width vs supply voltage (sda low) 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(sda high) : t i (s) spec ta=-40 ta= 25 ta= 85 figure 30. noise spike width vs supply voltage (sda high) 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(scl low) : ti(s) spec ta=-40 ta= 25 ta= 85 figure 29. noise spike width vs supply voltage (scl low) 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(scl high) : ti(s) spec ta=-40 ta= 25 ta= 85 figure 28. noise spike width vs supply vol t age (scl high)
. 13/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 34. wp high period vs supply voltage 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage : vcc(v) wp high period : t high:wp ( s) spec ta=-40 ta= 25 ta= 85 -0.3 -0.2 -0.1 0 0.1 0.2 0123456 supply voltage : vcc(v) wp setup time : t su:wp (s) spec ta=-40 ta= 25 ta= 85 figure 33. wp setup time vs supply voltage 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage : vcc(v) wp hold time : t hd:wp (s) spec ta=-40 ta= 25 ta= 85 figure 32. wp hold time vs supply voltage
. 14/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com timing chart 1. i 2 c bus data communication i 2 c bus data communication starts by start condition input, and e nds by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus data communication with several devices is possible by connecting with 2 communication lines: serial data (sda) and serial clock (scl). among the devices, there should be a ?ma ster? that generates clock and control communication start and end. the rest become ?slave? which are controlled by an address peculiar to each device, like this eepro m. the device that outputs data to the bus during data communication is called ?transmitter?, and the device that receives data is called ?receiver?.. 2. start condition (start bit recognition) (1) before executing each command, start condition (start bit) where sda goes from 'high' down to 'low' when scl is 'high' is necessary. (2) this ic always detects whether sda and scl are in start condition (start bit) or not, therefore, unless this condition is satisfied, any command cannot be executed. 3. stop condition (stop bit recognition) (1) each command can be ended by a stop condition (stop bit) where sda goes from 'low' to 'high' while scl is 'high'. 4. acknowledge (ack) signal (1) this acknowledge (ack) signal is a software rule to show whether data transfer has been made normally or not. in master-slave communication, the device (ex. -com sends slave address input for write or read command to this ic) at the transmitter (sending) side re leases the bus after output of 8bit data. (2) the device (ex. this ic receives the slave addre ss input for write or read co mmand from the -com) at the receiver (receiving) side sets sda 'low' during 9 th clock cycle, and outputs acknowledge signal (ack signal) showing that it has received the 8bit data. (3) this ic, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ack signal) 'low'. (4) after receiving 8bit data (word address and write data) during each write operation, this ic outputs acknowledge signal (ack signal) 'low'. (5) during read operation, this ic out puts 8bit data (read data), and detects ackn owledge signal (ack signal) 'low'. when acknowledge signal (ack signal) is detected, and stop condition is not sent from the master (-com) side, this ic continues to output data. when acknowledge signa l (ack signal) is not detec ted, this ic stops data transfer, and recognizes stop condition (stop bit), and e nds read operation. then this ic becomes ready for another transmission. 5. device addressing (1) slave address comes after start condition from master. (2) the significant 4 bits of slave address are used for recognizing a device type. the device code of this ic is fixed to '1010'. (3) next slave addresses (a2 a1 --- device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. (4) the most insignificant bit (r/w --- read/write) of slave address is used for designating write or read action, and is as shown below. setting r / w DD to 0 ------- write (setting 0 to word address setting of random read) setting r / w DD to 1 ------- read p0 is page select bit. type slave address maximum number of connected buses BR24T1M-3AM 1 0 1 0 a2 a1 p0 r/ w DD 4 89 89 89 s p condition condition ack stop ack data data addres s start r/w ack 1-7 sda scl 1-7 1-7 figure 35. data transfer timing
. 15/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com write command 1. write cycle (1) arbitrary data can be written to eeprom. when writing only 1 byte, byte write is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. the maximum number of write bytes is specified per device of each capacity. up to 256 arbitrary bytes can be written. in the case of BR24T1M-3AM (2) during internal write execution, all input co mmands are ignored, therefore ack is not returned. (3) data is written to the address designated by word address (n-th address) (4) by issuing stop bit after 8bit data inpu t, internal write to memory cell starts. (5) when internal write is started, command is not accepted for t wr (5ms at maximum). (6) using page write cycle, writing in bulk is done as follows: up to 256byte (BR24T1M-3AM the bytes in excess overwrite the data already sent first. (refer to "internal address increment") (7) as for page write cycle of BR24T1M-3AM, where 2 or more bytes of data is intended to be written, after the page select bit ?p0? of slave, and the 8 significant bits of wo rd address are designated arbitr arily, only the value of 8 least significant bits in the address is incremented internal ly, so that data up to 256 bytes of memory only can be written. a1 a2 wa 14 1 1 0 0 w r i t e s t a r t r / w s t o p 1st word address data slave address p0 d0 a c k sda line a c k a c k wa 0 a c k 2nd word address d7 wa 15 figure 36. byte write cycle figure 37. page write cycle w r i t e s t a r t r / w a c k s t o p 1st word a ddress(n) sda line a c k a c k data(n+255) a c k slave a ddress 1 0 0 1 p0 a 1 a 2 wa 14 d0 data(n) d0 d7 a c k 2nd word a ddress(n) wa 0 wa 15
. 16/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 2. notes on write cycle continuous input list of numbers of page write page size 256byte product number BR24T1M-3AM the above numbers are maximum bytes for respective types. any bytes below these can be written. in the case BR24T1M-3AM, 1 page=256bytes, but the page write cycle time is 5ms at maximum for 256byte bulk write. it does not stand 5ms at maximum 256byte=1280ms(max) 3. internal address increment page write mode (in the case of BR24T1M-3AM 4. write protect (wp) terminal write protect (wp) function when wp terminal is set at vcc (h level), data rewrite of all addresses is prohibited. when it is set gnd (l level), data rewrite of all address is enabled. be sure to connect this terminal to vcc or gnd, or control it to h level or l level. do not leave it open. in case of using it as rom, it is recommended to connect it to pull up or vcc. at extremely low voltage at power on/off, by setting the wp terminal ?h?, write error can be prevented. for example, when it is started from address feh, then, increment is made as below, feh ffh 00h 01h ??? please take note. feh ??? fe in hexadecimal, therefore, 11111110 becomes a binary number. wa16 wa8 wa7 wa6 wa5 wa4 wa3 wa2 wa1 wa0 0 000000000 0 000000001 0 000000010 0 011111110 0 011111111 0 0 0000000 increment feh significant bit is fixed. no digit up
. 17/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com read command 1. read cycle read cycle is when data of eeprom is read. read cycle coul d be random read cycle or current read cycle. random read cycle is a command to read data by designating a specif ic address, and is used generally. current read cycle is a command to read data of internal address register without des ignating an address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycl e is available where the next address data can be read in succession. (1) in random read cycle, data of designated word address can be read. (2) when the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read addr ess (n)-th, i.e., data of the (n+1)-th address is output. (3) when ack signal 'low' after d0 is detected, and stop condition is not sent from master ( -com) side, the next address data can be read in succession. (4) read cycle is ended by stop condition where 'h' is input to ack signal after d0 and sda signal goes from ?l? to ?h? while at scl signal is ?h?. (5) when 'h' is not input to ack signal after d0, sequential read gets in, and the next data is output. therefore, read command cycle cannot be ended. to end read command cycle, be sure to input 'h' to ack signal after d0, and the stop condition where sda goes from ?l? to ?h? while scl signal is 'h'. (6) sequential read is ended by stop condition where 'h' is input to ack signal after arbitrary d0 and sda is asserted from ?l? to ?h? while scl signal is 'h'. w r i t e s t a r t r / w a c k s t o p 1st word address? sda line a c k a c k data(n) a c k slave address 1 0 0 1 p0 a1 a2 wa 14 d7 d0 2nd word address? a c k s t a r t slave address 1 0 0 1 a2 a1 r / w r e a d p0 wa 0 wa 15 figure 38. random read cycle r e a d s t a r t r / w a c k s t o p data(n) sda line a c k a c k data(n+x) a c k slave address 10 0 1 p0 a1 a2 d0 d7 d0 d7 figure 40. sequential read cycle (in the case of current read cycle) s t a r t s t o p sda line a c k data(n) a c k slave address 10 0 1 p0 a1 a2 d0 d7 r / w r e a d figure 39. current read cycle
. 18/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com software reset software reset is executed to avoid malfunction after po wer on, and during command input. software reset has several kinds, and 3 kinds of them are shown in the figure below. (refer to figure 41-(a)., figure 41-(b)., figure 41-(c).) within the dummy clock input area, the sda bus is released ('h' by pu ll up) and ack output and read data '0' (both 'l' level) may be output from eeprom. therefore, if 'h' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. acknowledge polling during internal write execution, all in put commands are ignored, therefore ack is not returned. during internal automatic write execution after write cycle input, next command (slave addr ess) is sent, and if the first ack signal sends back 'l', then it means end of write oper ation, else 'h' is returned, which means writing is still in progress. by the use of acknowledge polling, next command can be executed without waiting for t wr = 5ms. to write continuously, r/w = 0, then to ca rry out current read cycle after write, sl ave address with r/w = 1 is sent, and if ack signal sends back 'l', then execute word address input and data output and so forth. 1 2 13 14 scl dummy clock14 start2 scl figure 41-(a). the case of dummy clock 14 +start+start+ command input start command from start input. 2 1 8 9 dummy clock 9 start figure 41-(b). the case of start + dummy clock 9 +start+ command input start normal command normal command normal command normal command start 9 sda sda scl 1 2 3 8 9 7 figure 41-(c). start9+ command input normal command normal command sda slave address word address s t a r t first write command a c k h a c k l slave address slave address slave address data write command during internal write, ack = high is returned. after completion of internal write, ack=low is returned, so input next word address and data in succession. t wr t wr second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l figure 42. case to continuous write by acknowledge polling sda
. 19/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com wp valid timing (write cancel) wp is usually fixed to 'h' or 'l', but when wp is used to ca ncel write cycle and so on, pay attention to the following wp valid timing. during write cycle execution, inside cancel valid area , by setting wp='h', write cycle can be cancelled. in both byte write cycle and page write cycle, the area fr om the first start condition of command to the rise of clock to take in d0 of data (in page write cycle, the first byte data) is the cancel invalid area. wp input in this area becomes ?don't care?. the area from the ri se of scl to take in d0 to the stop condition input is the cancel valid area. furthermore, after the execution of forced end by wp, the ic enters standby status. command cancel by start condition and stop condition during command input, by continuously inputting start conditi on and stop condition, command can be cancelled. (figure 44.) however, within ack output area and during data read, sda bus may output 'l'. in this case, start condition and stop condition cannot be input, so reset is not available. theref ore, execute software reset. when command is cancelled by start-stop condition during random read cy cle, sequential read cycle, or current read cycle, internal setting address is not determined. therefore, it is not possible to carry out current read cycle in succession. to carry out read cycle in succession, carry out random read cycle. ? rise of d0 taken clock scl d0 ack enlarged view scl sda ack d0 ? rise of sda sda wp wp cancel invalid area wp cancel valid area data is not written. figure 43. wp valid timing slave address d7 d6 d5 d4 d3 d2 d1 d0 data t wr sda d1 s t a r t a c k l a c k l a c k l a c k l s t o p word address figure 44. case of cancel by start, stop condition during slave address input scl sda 1 1 0 0 start condition stop condition enlarged view wp cancel invalid area
. 20/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com i/o peripheral circuit 1. pull up resistance of sda terminal sda is nmos open drain, so it requires a pull up resistor. as for this resistor value (r pu ), select an appropriate value from microcontroller v il , i l , and v ol -i ol characteristics of this ic. if r pu is large, operating frequency is limited. the smaller the r pu , the larger is the supply current (read). 2. maximum value of r pu the maximum value of r pu is determined by the following factors. (1)sda rise time to be determined by the capacitance (c bus ) of bus line of sda and r pu should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is late. (2)the bus electric potential a to be determined by input leak total (i l ) of device connected to bus at output of 'h' to sda bus and r pu should sufficiently secure the input 'h' level (v ih ) of microcontroller and eeprom including recommended noise margin of 0.2v cc . v cc - i l r pu - 0.2 v cc R v ih r pu Q 0.8v cc v ih i l ex.) v cc =3v i l =10 a v ih =0.7 v cc from (2) Q 30 [k ? ] 3. minimum value of r pu the minimum value of r pu is determined by the following factors. (1) when ic outputs low, it should be satisfied that v olmax =0.4v and i olmax =3ma. (2) v olmax =0.4v should secure the input 'l' level (v il ) of microcontroller and eeprom including recommended noise margin 0.1v cc . v olmax Q v il -0.1 v cc ex.) v cc =3v, v ol =0.4v, i ol =3ma, microcontroller, eeprom v il =0.3v cc and v ol =0.4 [v] v il =0.3 3 =0.9 [v] therefore, the conditi on (2) is satisfied. 4. pull up resistance of scl terminal when scl control is made at the cmos output port, there is no need for a pull up resistor. but when there is a time where scl becomes 'hi-z', add a pull up resistor. as for the pull up resistor value, one of several k ? to several ten k ? is recommended in consideration of drive per formance of output port of microcontroller. i ol r pu R v cc v ol i ol v cc v o l r pu Q R 867 [ ? ] r pu R 3 0.4 310 -3 from (1) microcontroller r pu a sda terminal i l i l bus line capacity c bus figure 45. i/o circuit diagram br24txx
. 21/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com cautions on microcontroller connection 1. r s in i 2 c bus, it is recommended that sda port is of open drain i nput/output. however, when us ing cmos input / output of tri state to sda port, insert a series resistance r s between the pull up resistor r pu and the sda terminal of eeprom. this is to control over current that may occur when pm os of the microcontroller and nmos of eeprom are turned on simultaneously. r s also plays the role of protecting the sda terminal against surge. therefore, even when sda port is open drain input/output, r s can be used. 2. maximum value of r s the maximum value of r s is determined by the following relations. (1) sda rise time to be determined by the capacitance (c bus ) of bus line of sda and r pu should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is slow. (2) the bus electric potential a to be determined by r pu and r s the moment when eeprom outputs 'l' to sda bus should sufficiently secure the input 'l' level (v il ) of microcontroller including recommended noise margin of 0.1v cc . 3. minimum value of r s the minimum value of r s is determined by over current at bus collisio n. when over current flows, noises in power source line and instantaneous power failure of power source may occur. when allowable over current is defined as i, the following relation must be satisfied. determine the allo wable current in considerati on of the impedance of power source line in set and so forth. set the over current to eeprom at 10ma or lower. r pu microcontroller r s eeprom figure 46. i/o circuit diagram figure 47. input / output collision timing a ck 'l' output of eeprom 'h' output of microcontroller over current flows to sda line by 'h' output of microcontroller and 'l' output of eeprom. scl sda microcontroller eeprom 'l'output r s r pu 'h' output over current i figure 49. i/o circuit diagram Q 1.67 [k ? ] Q 0.33 0.4 0.13 2010 3 1.13 0.33 r s r pu 1.1v cc -v il ex. v cc =3v v il =0.3v cc v ol =0.4v r pu =20k r s Q v il v ol 0.1v cc (v cc v ol )r s +v ol +0.1v cc Q v il r pu +r s v cc r s v cc i R 300 [ ? ] ex.) vcc=3v, i=10m a r s R 3 1010 -3 Q i r s R r pu micro controller r s eeprom i ol a bus line capacity c bus v ol v cc v il figure 48. i/o circuit diagram
. 22/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com i/o equivalence circuit 1. input (a0, a1, a2, scl, wp) 2. input / output (sda) power-up/down conditions at power on, the ic?s internal circuits may go through unstabl e low voltage area as the vcc rises, making the ic?s internal logic circuit not completely reset, hence, malfunction may occur. to prevent this, the ic is equipped with por circuit and lvcc circuit. to assure the operation, obser ve the following conditions at power on. 1. set sda = 'h' and scl ='l' or 'h? 2. start power source so as to satisfy the recommended conditions of t r , t off , and v bot for operating por circuit. t off t r v bot 0 v cc 3. set sda and scl so as not to become 'hi-z'. when the above conditions 1 and 2 cannot be obs erved, take the following countermeasures. (1) in the case when the above condition 1 cannot be observed such that sda becomes 'l' at power on. control scl and sda as shown below, to make scl and sda, 'h' and 'h'. (2) in the case when the above condition 2 cannot be observed. after power source becomes stable, execute software reset(page18). (3) in the case when the above conditions 1 and 2 cannot be observed. carry out (1), and then carry out (2). low voltage malfunction prevention function lvcc circuit prevents data rewrite operation at low power, and pr events write error. at lvcc voltage (typ =1.2v) or below, data rewrite is prevented. noise countermeasures 1. bypass capacitor when noise or surge gets in the power source line, malfuncti on may occur, therefore, it is recommended to connect a bypass capacitor (0.1 f) between the ic?s v cc and gnd pins. connect the capacitor as close to ic as possible. in addition, it is also recommended to connect a bypass capacitor between board?s v cc and gnd. recommended conditions of t r , t off ,v bot t r t off v bot 10ms or below 10ms or larger 0.3v or below 100ms or below 10ms or larger 0.2v or below figure 52. rise waveform diagram t low t su:dat t dh a fter vcc becomes stable scl v cc sda figure 53. when scl= 'h' and sda= 'l' t su:dat a fter vcc becomes stable figure 54. when scl='l' and sda='l' v cc scl sda figure 50. input pin circuit diagram figure 51. input / output pin circuit diagram
. 23/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperatur e and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rati ng be exceeded the rise in te mperature of the chip may result in deterioration of the properti es of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guar anteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consi deration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoide d. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if t he power supply voltage is applied, make sure that the input pins have voltages within the values specifi ed in the electrical characteristics of this ic.
. 24/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com part numbering b r 2 4 t 1 m x x - 3 a m e 2 lineup capacity package orderable part number remark type quantity 1mbit sop-j8 reel of 2500 br24t1mfj -3ame2 halogen free 100% sn sop8 reel of 2500 br24t1mf -3ame2 halogen free 100% sn bus type 24 i 2 c operating temperature / operating voltage -40c to +85c / 1.7v to 5.5v packaging and forming specification e2 : embossed tape and reel (sop-j8, sop8) : process code : revision : automotive 3 a m 1m=1024kbit capacity : sop8 f package fj : sop-j8
. 25/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimensions, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
. 26/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension, tape and reel information - continued package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr))
. 27/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com marking diagrams sop8 (top view) 4t1ma part number marking lot numbe r 1pin mark sop-j8(top view) 4t1ma part number marking lot numbe r 1pin mark
. 28/28 datasheet d a t a s h e e t BR24T1M-3AM tsz02201-0gfg0g100430-1-2 08.jul.2016 rev.001 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com revision history date revision changes 08.jul.2016 001 new release
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number br24t1mf-3am package sop8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes br24t1mf-3am - web page

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